ASIC
Specialized IC Packaging Solutions for Fabless ASIC Design Firms
Our advanced IC packaging services enable fabless ASIC design firms to achieve optimized device performance, power efficiency, and form factor. Each solution is carefully tailored to align with your budget, performance, and size requirements. Through systematic reliability qualification processes and strict adherence to industry quality standards, we ensure packaging solutions that consistently meet the needs of mission-critical and high-reliability applications.
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Why Partner with izmomicro?
01
Packaging-Centric ASIC Design
Packaging is integrated into the ASIC architecture from the start—not treated as an afterthought.
02
Broad Package Portfolio
From legacy to advanced types, we offer options that let designers balance performance with cost.
03
Comprehensive Testing & Qualification
Full validation against JEDEC, AEC-Q100, and other standards ensures reliability and compliance.
04
Concurrent Co-Design
Align ASIC, package, and PCB development in parallel to achieve first-pass success and avoid delays.
05
Cross-Industry Experience
Our ISO 9001:2015 certified facility ensures high-quality manufacturing in a cost-efficient Trusted by customers across commercial, automotive, aerospace/defense, and telecom sectors.
End-to-End Flexible Packaging Solutions for Legacy and
Advanced ASICs
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