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PRESS RELEASE

07 OCT 2026

izmo Microsystems and IIT Madras Enter Phase II of ₹99.94 Crore MeitY-Sanctioned Silicon Photonics Program

Five-year CPPICS SPECTRA program targets 1.6 Tbps optical transceivers, co-packaged optics, quantum communications and photonic AI

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Photonic Chip Packaging Initiative

Advancing Next-Generation
Photonic Processors

15 SEP 2026 MILESTONE

izmo Microsystems Unveils Silicon Photonics Modules at SEMICON India 2026

Showcasing India’s first production-ready advanced packaging capabilities for Data Center Interconnects and Quantum Infrastructure.

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1 SEP 2026 MILESTONE

izmo Microsystems Develops Indigenous 40 GHz RF Semiconductor Package

India’s leading semiconductor packaging company enters the defence electronics value chain as the nation’s indigenization mandate.

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27 APRIL 2026 MILESTONE

izmo Microsystems Recognized as Key Packaging Partner in India's National Silicon Photonics Mission

A milestone recognition cementing izmomicror's role in India's semiconductor ecosystem and national silicon photonics infrastructure development.

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01 APR 2026 DEFENCE

izmo Microsystems Builds Ongoing Defence Electronics Supply Business in Advanced Semiconductor Packaging

Securing multi-year contracts for mission-critical defense electronics packaging, including space-grade SiP modules and ruggedized power assemblies.

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09 MAR 2026 DEFENCE

izmo Microsystems Advances into India's Defence Sector with Advanced Semiconductor Packaging

New strategic initiative to provide indigenous packaging solutions for defense-grade electronics, reducing import dependency for critical subsystems.

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12 JAN 2026 MILESTONE

izmo Microsystems Achieves Milestone in 3D Space-Grade Packaging; Realizes 84% Footprint Reduction

Breakthrough 3D SiP integration for satellite payload camera electronics, delivering dramatic miniaturization while maintaining full space-grade reliability.

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30 SEP 2025 DEFENCE

izmo Ltd. Receives Prestigious DSIR Recognition for In-House R&D Unit

New strategic initiative to provide indigenous packaging solutions for defense-grade electronics, reducing import dependency for critical subsystems.

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16 SEP 2025 MILESTONE

izmo Microsystems Announces Breakthrough in High-Power Motor Control Technology

Advanced IGBT power module packaging with integrated DBC substrate for next-generation BLDC motor drivers and EV inverter systems.

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21 AUG 2025 MILESTONE

izmo Microsystems Achieves Breakthrough in Silicon Photonics Packaging

Sub-2 micrometer active alignment and less than 0.5 dB insertion loss demonstrated in production-grade silicon photonics packaging, a first for India.

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25 MARCH 2025 MILESTONE

izmo Microsystems Partners with IIT Madras for Cutting-Edge Photonic Chip Packaging Solutions

The partnership focuses on the design, development, and advanced packaging of programmable photonic processor core using Silicon Photonics Technology.

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Whether you're developing a silicon photonic transceiver, co-packaged optics module, or a novel photonic integrated circuit, our team provides end-to-end packaging support from design consultation through volume manufacturing.

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Prototype through volume production
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