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izmo Microsystems Recognized as Key Packaging Partner in India’s National Silicon Photonics Mission
India's leading semiconductor packaging company recognized as a key packaging partner in India's National Silicon Photonics MissionBENGALURU, India–April 27, 2026—izmomicro (izmo Microsystems Pvt. Ltd.), the advanced semiconductor packaging subsidiary of NSE/BSE-listed izmo Limited, continues to make significant strides in developing world-class design and manufacturing capabilities. It has been recently recognized as a key packaging partner in India's National Silicon Photonics Mission.
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izmomicro Builds Ongoing Defence Electronics Supply Business in Advanced Semiconductor Packaging
India's leading semiconductor packaging company expands ongoing supply of advanced semiconductor packaging solutions to India's Defence Electronics sector.BENGALURU, India— April 01, 2026 — izmomicro (izmo Microsystems Pvt. Ltd.), the advanced semiconductor packaging subsidiary of NSE/BSE-listed izmo Limited, today announced the ongoing supply of advanced semiconductor packaging solutions to India’s defence electronics sector, marking a significant expansion of its business in high-reliability, mission-critical applications.
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izmomicro Advances into India’s Defence Sector with Advanced Semiconductor Packaging
India’s leading semiconductor packaging company enters the defence electronics value chain as the nation’s indigenization mandate and record defence budgets reshape the industry.BENGALURU, India — March 09, 2026 — izmomicro (izmo Microsystems Pvt. Ltd.), the advanced semiconductor packaging subsidiary of NSE/BSE-listed izmo Limited, today announced its strategic entry into India’s defence electronics sector.
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izmo Ltd. Receives Prestigious DSIR Recognition for In-House R&D Unit
BENGALURU, India – September 30, 2025 – izmo Ltd. has been formally recognized by the Department of Scientific and Industrial Research (DSIR), Government of India, as an approved in-house Research & Development (R&D) unit.MORE
izmo Microsystems Achieves Milestone in 3D Space-Grade Packaging; Realizes 84% Footprint Reduction
BENGALURU, INDIA — January 12, 2026 — izmo Ltd. (NSE: IZMO) today announced that its specialized division, izmo Microsystems, has successfully designed a high-complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics.MORE
izmomicro Achieves Breakthrough in Silicon Photonics Packaging, Establishing India’s Leadership in Advanced Semiconductor Integration
BENGALURU, India — August 21, 2025 — Develops high-density silicon photonics packaging platform capable of supporting 32-channel fiber input and output with an industry-leading insertion loss of less than 2 dB.MORE
izmomicro Announces Breakthrough in High-Power Motor Control Technology
BENGALURU, India — September 16, 2025 — izmomicro today announced a major breakthrough in high-performance motor control technology with the launch of its latest in-house innovation designed for demanding industrial, electric vehicle, and next-generation energy applications.MORE
izmo Microsystems Partners with IIT Madras for Cutting-Edge Photonic Chip Packaging Solutions
BENGALURU, India — March 25, 2025 — The partnership focuses on the design, development, and advanced packaging of programmable photonic processor core using Silicon Photonics Technology, a pioneering step in the evolution of photonic computing and communication.MORE