Advanced Semiconductor Packaging
Precision Packaging
for
Next-Generation Silicon
From silicon photonics and co-packaged optics to 3D SiP modules and power electronics - India's only dedicated advanced packaging facility delivering design-through-production semiconductor solutions.
<0.5 dB Insertion Loss
sub-2µm Active Alignment
32-ch Fiber I/O Platform
Class 1000 Cleanroom Facility
