Power Integration
High-Performance Packaging for Energy-Intensive Applications
At izmomicro, we provide advanced power module packaging solutions engineered for high-performance, reliability, and scalability across automotive, industrial, renewable energy, and high-reliability markets. Our capabilities span motor control, power conversion, and energy management systems, where efficient packaging plays a vital role in optimizing electrical performance and thermal management. With a focus on robust design and scalable manufacturing, we help customers accelerate innovation in energy-intensive applications.
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Why Partner with izmomicro?
01
Specialized Power Electronics Packaging
Expertise in packaging, interconnects, and thermal design for high-performance power systems.
02
Proven Technology Integration
Extensive experience with BLDC drivers, IGBT/SiC/GaN modules, and isolation solutions for demanding applications.
03
Comprehensive Development Support
End-to-end services including substrate design, process engineering, assembly, testing, and qualification
04
Cross-Industry Experience
Trusted by customers across commercial, automotive, and telecom sectors.
05
Certified World-Class Infrastructure
Our ISO 9001:2015 certified facility ensures high-quality manufacturing in a cost-efficient environment..
Variable Speed Drive Power Modules for Demanding Applications
BLDC Motor Driver Modules
- Compact, rugged packages for Brushless DC (BLDC) motor control in automotive and industrial applications.
- Integration of driver ICs, MOSFETs/IGBTs, and protection circuitry into a single, thermally optimized package.
- Designed for low conduction losses and reliable high-current handling
Hex Bridge Modules
- Configurable half-bridge and full-bridge topologies for motor drives and inverters
- Efficient interconnect design for reduced parasitic inductance and optimized switching speeds.
- Suitable for EV traction inverters, robotics, and power tools.
IGBT Power Modules
- High-voltage modules supporting traction, industrial drives, renewable inverters, and UPS systems.
- Low thermal resistance layouts with high current density packaging.
- Enhanced reliability for demanding operating conditions with robust solder attach and wire bond options.
Advanced Assembly Techniques for Miniaturization, Speed, and Sustainability
Substrate Technologies
- Direct-Bonded Copper (DBC) – industry standard for high-power density and thermal performance.
- Direct-Bonded Aluminum (DBA) – lightweight alternative with improved thermal expansion matching.
- Active Metal Brazing (AMB) – excellent for high-voltage, high-temperature reliability.
- Insulated Metal Substrate (IMS) – cost-effective solution for medium-power modules and compact designs.
Thermal Management
- Void-free soldering with optimized fluxes for improved thermal paths and reduced hotspots.
- Double-sided cooling architectures to maximize heat dissipation.
- Use of high-conductivity materials, thermal interface management, and lid/spreader designs for reliable long-term operation.
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