sip
Advanced Packaging and Production Capabilities for Mission-Critical Applications
At izmomicro, we specialize in advanced System-in-Package (SiP) solutions, offering end-to-end semiconductor packaging and manufacturing services. From substrate design to full-scale production, our capabilities support every stage of your product lifecycle—engineering samples, prototypes, pilot runs, qualifications, and volume manufacturing.
Talk to an Expert
Talk to an Expert
Why Partner with izmomicro?
01
Multidisciplinary Expertise
Tap into specialized skills and advanced tools for thermal management, electrical interference reduction, and rigorous testing to minimize design risks.
02
Advanced Packaging Technology
Utilize state-of-the-art techniques such as flip chip, wire bonding, and wafer-level packaging for robust and high-performance SiP delivery.
03
Robust Thermal & System Integration
Ensure reliable operation in harsh environments, including space, with specialized heat transfer simulations and thermal management techniques.
04
Cross-Industry Experience
Trusted by customers across commercial, automotive, aerospace/defense, and telecom sectors.
05
Certified World-Class Infrastructure
Our ISO 9001:2015 certified facility ensures high-quality manufacturing in a cost-efficient environment.
Solutions Engineered to Meet High-Performance, High-Density Applications
Design Capabilities
- Package design – Organic, LTCC, HTCC, Thermally Enhanced
- SI & PI Analysis
- Thermal & Thermo-mechanical Analysis
- EMI/EMC Analysis
Product Categories
- Packages – QFN, BGA, PQFP, CQFP, DIP, Metal Can & COB
- MCM
- System in Package
- Thick Film Hybrid Microcircuits
- Thin Film Hybrid Circuits
- RF and Microwave modules
Technology and Process
- Flip Chip
- 3D Packaging
- MEMS Packaging
- Thin Die, Brittle Die
- Hermetic Sealing
- Optical Assembly
Industries We Serve
Need Help?
Consult with one of our technical experts today. Kindly share your contact details, and we’ll get in touch promptly.
