Advanced Photonic Integration & System-in-Package (SiP) Solutions
India's First End-to-End Silicon Photonics Manufacturing Partner
With over a decade of experience in IC Packaging & System-in-Package (SiP), izmomicro has built a state-of-the-art photonic packaging & manufacturing ecosystem. We are India’s first and only Silicon Photonics packaging provider, with advanced facilities and collaborations that enable cutting-edge solutions.
1. Precision Silicon Photonics Assembly & Packaging
Heterogeneous Integration
Heterogeneous System-in-Package (SiP) for photonic integration
Sub-micron Alignment
Sub-micron active alignment of fiber arrays, waveguides & laser sources
High-speed Interconnects
High-speed electrical & optical interconnect design
Low-loss Coupling
Low-insertion-loss fiber attach & photonic waveguide coupling
2.High-Performance Packaging Design
Thermal Management
Heat spreaders, TEC, and optimized material selection
Signal Integrity
Signal Integrity & Power Integrity Optimization for high-speed applications
2.5D & 3D Packaging
2.5D & 3D packaging solutions for next-gen photonic ICs
Optical & RF Co-packaging
Optical & RF co-packaging for high- bandwidth, low-latency performance
3. Mid-Volume Silicon Photonics Manufacturing
Optimized Production Lines
Fully optimized mid-volume production lines for photonic devices
Custom Test & Validation
Custom test & validation solutions to ensure high-yield, reliable packaging
Co-packaged Optics Expertise
Expertise in co-packaged optics for AI, cloud, & data center applications
4. Exclusive Industry Collaboration with IIT Madras
izmomicro is the exclusive industry partner in the IIT Madras Photonic Chip Packaging Initiative, working on:
Applications of izmomicro’s Silicon Photonics Solutions
Contact Our PIC Experts
Ready to take your photonic integration to the next level? Use the form below to Contact our Photonic Integrated Circuit (PIC) experts to explore how izmomicro can help design, package, and manufacture your next-generation Silicon Photonics solutions.