At izmo microsystems, we specialize in System in Package (SiP) design and manufacturing, providing strategic support to SiP manufacturers looking to offload excess work, legacy devices, or lower-end production to a trusted partner.
We offer a scalable, cost-effective solution to help SiP manufacturers optimize their production capacity while focusing on high-value projects.
Free up internal resources for advanced projects while we handle your overflow production.
Our processes align with your existing manufacturing standards to ensure consistency and quality.
Maintain profitability on older SiP designs without using valuable internal resources.
Whether you need temporary support for high-demand periods or ongoing manufacturing partnerships, we adapt to your needs.
Our ISO 9001:2015 certified facility ensures high-quality manufacturing in a cost-efficient environment.
Utilize our state-of-the-art facility to scale up quickly without investing in additional
infrastructure.We specialize in 2.5D/3D, Wirebond, Flip-Chip, LTCC, HTCC, and RF integration.
Full thermal, signal integrity, and EMI/EMC analysis to ensure product quality related to design.
Full thermal, signal integrity, power integrity, and EMI/EMC analysis to ensure product quality.
We build custom test setup and carry out ESS tests as per JEDEC, MIL-STD, and AEC-Q100 Standards.
Offload your excess SiP manufacturing to a reliable partner.
Maintain production of older SiP devices without tying up internal resources.
Work with us for cost-effective, high-quality SiP manufacturing that supports your long-term growth.
We understand the challenges of managing fluctuating production demands. Whether you need to free up in-house capacity, reduce costs, or optimize production efficiency, izmo microsystems is here to help.
To get in touch, use the form below.