ASIC PACKAGING SOLUTIONS
Packaging-centric co-design for fabless ASIC firms. From architecture review through volume production, we deliver optimized electrical performance, thermal management, and signal integrity across QFN, BGA, flip-chip, and 3D SiP platforms.
WHY IZMO FOR ASIC
From early-stage architecture through volume production, we integrate packaging expertise into every phase of your ASIC development. Our concurrent co-design approach eliminates costly iterations and accelerates your time to silicon.
IP SECURITY
Advanced SiP packaging techniques create an inherent layer of IP protection by integrating complex systems into discreet, non-discernible modules.
Our IP-secured packaging environment ensures your proprietary designs remain protected throughout the development lifecycle - from initial concept through volume production.
PACKAGE TECHNOLOGIES
A comprehensive spectrum of IC package formats engineered for performance, reliability, and manufacturability across every application domain.
Compact, high-performance packages with excellent thermal and electrical performance in a near chip-scale footprint. Low-inductance ground connections via exposed pad for superior high-frequency operation.
Industry-standard substrate-based packaging supporting fine-pitch routing and multi-layer signal distribution. High I/O density with superior thermal dissipation through solder ball array.
Near-die-size packaging enabling the smallest possible form factor with direct board-level solder attach. Fan-in and fan-out WLP options for mobile, wearable, and IoT applications.
Direct die attach for lowest inductance and highest-speed performance. Cu pillar or solder bump technology for superior signal integrity and power delivery at multi-GHz frequencies. Ideal for HPC, networking, and RF.
Multi-die stacking with through-silicon vias or wire bond interconnects for heterogeneous integration of digital, analog, and sensor functions in a single package footprint.
Tailored packaging solutions for unique requirements including hermetic seal, ceramic cavity, open-cavity QFN, and HTCC/LTCC substrates for aerospace, defense, medical, and sensor applications.
STRATEGIC PARTNERSHIP
Collaborating on programmable photonic processors (FPPGA), quantum and AI-driven photonic integration, and silicon photonics for telecom and computing - bridging academic research with commercial-scale packaging.
Full-wave electromagnetic simulation of signal integrity and power delivery networks across package and PCB.
CFD-based thermal simulation and heat spreader design for high-power ASIC applications.
Multi-layer organic, LTCC, and HTCC substrate layout with fine-pitch routing and via optimization.
Design for manufacturability and testability reviews ensuring production-ready package designs.
QUALITY & RELIABILITY
Every ASIC package undergoes comprehensive reliability qualification protocols to meet the most demanding industry standards. Our testing framework covers the full spectrum of environmental, mechanical, and electrical stress conditions.
END-TO-END SUPPORT
Our integrated approach ensures seamless progression through every stage of ASIC packaging development.
PHASE 01
ARCHITECTURE
Collaborative design of ASIC, package substrate, and PCB in parallel. Signal integrity, power delivery, and thermal analysis from the earliest stages to eliminate costly respins.
PHASE 02
VALIDATE
Rapid prototyping with full JEDEC and AEC-Q100 qualification testing. Comprehensive reliability validation including thermal cycling, HAST, and board-level reliability assessment.
PHASE 03
PRODUCE
Scalable production from engineering samples through full-rate manufacturing. Consistent quality assured by ISO 9001:2015 processes and advanced in-line inspection systems.
Partner with izmomicro for packaging-centric co-design that delivers first-pass success. From architecture review through volume production, we bring decades of ASIC packaging expertise to your project.
Packaging-centric ASIC design
Broad package portfolio
Comprehensive testing and qualification
Aligned ASIC, package & PCB for first-pass success
