WHY IZMOMICRO FOR POWER

Core Advantages in Power Module Packaging

Deep expertise in high-current, high-voltage packaging with advanced thermal management and rigorous reliability qualification. Optimized packaging architectures that maximize power density while maintaining thermal headroom for demanding automotive and industrial applications.

• Si IGBT, SiC MOSFET, and GaN device packaging
• Configurable half-bridge and full-bridge topologies
• Advanced wire bonding and silver sintering interconnects
• Prototype through high-volume production

ADVANCED CAPABILITIES

Thermal Excellence for Power Electronics

Void-free soldering, double-sided cooling architectures, and high-conductivity substrate materials for superior thermal dissipation under extreme operating conditions.

Full compliance with AEC-Q101 and AQG-324 standards for automotive-grade reliability. FEA-driven thermal modeling integrated into the design flow from initial concept through qualification.

• X-ray inspected solder joints with <5% void rate
• 30-40% thermal resistance improvement via dual heat-path
• Copper baseplates, AlSiC composites, silver sintering

GREEN ENERGY

EV & Renewable Energy Power Modules

Flexible module architectures that scale from evaluation kits to high-volume production. Configurable topologies to match your exact power stage requirements for electric vehicle and renewable energy applications.

• Deep capabilities in DBC, DBA, AMB, and IMS substrate technologies
• Material selection optimized for SiC, GaN, and Si power devices
• Power cycling, thermal shock, and humidity testing protocols
• EV traction inverters, on-board chargers, solar inverters