RF & Microwave
RF & Microwave Packaging
Precision semiconductor packaging engineered for high-frequency performance, from RF front-end modules to complete multi-chip microwave assemblies. Low insertion loss, controlled impedance, and manufacturability at scale.
Purpose-Built for High Frequency
Purpose-built packaging solutions optimized for high-frequency performance, from single-chip to complex multi-chip RF systems. Electromagnetic simulation-driven package design with SI/PI analysis ensures impedance matching and minimal signal degradation from die to board.
- Open-cavity & molded QFN, flip-chip BGA, RF module assembly
- EM simulation-driven co-design with SI/PI analysis
- Wire bond, flip-chip, and over-mold under one roof
- Class 1000 cleanroom, ISO 9001:2015 certified
Across the RF Spectrum
Packaging solutions engineered for every major frequency band, from sub-6 GHz commercial wireless through mmWave defense radar.
5G NR & LTE
FR1 base station front-ends, small cell power amplifiers, and massive MIMO beamforming modules for commercial 5G infrastructure.
mmWave 5G & Satellite
FR2 antenna-in-package modules, Ka-band satellite terminals, VSAT upconverters, and point-to-point microwave backhaul transceivers.
Automotive Radar
77 GHz FMCW radar front-ends for ADAS and autonomous driving. Flip-chip BGA packages with low-loss substrate routing for SRR/LRR sensors.
Wi-Fi 6E/7 & IoT
Integrated RF front-end modules for Wi-Fi 6E/7 access points, IoT edge devices, and Bluetooth/Zigbee combo SoCs with small form factor packaging.
Open-Cavity QFN
Air-cavity packages for RF front-end components, MMICs, power amplifiers, and low-noise amplifiers. Low-inductance ground paths and controlled cavity environments for optimal RF performance. Ideal for devices requiring wire bond access or hermetic sealing options.
- Low parasitic inductance ground paddle
- Optional hermetic lid sealing
- Controlled cavity for thermal & RF performance
Molded QFN
High-volume manufacturing-ready packages with 50-ohm controlled impedance transmission lines. Optimized mold compound selection for minimal dielectric loss at frequency. Cost-effective solution for commercial wireless and IoT applications requiring consistent RF performance at scale.
- 50Ω controlled impedance traces
- Low-Dk mold compound optimization
- Scale-ready automated assembly
Flip-Chip BGA
High-frequency signal routing with organic or ABF (Ajinomoto Build-up Film) substrates and Cu pillar attach for minimal parasitic inductance. Advanced substrate design enabling multi-layer RF signal routing, integrated passives, and high-density I/O for mmWave and sub-6 GHz applications.
- Cu pillar for low parasitic inductance
- Multi-layer RF signal routing
- Integrated passives & high-density I/O
RF Module Assembly
Multi-chip systems integrating filters, power amplifiers, switches, and antenna-in-package for complete RF front-end solutions. Designed for 5G NR, Wi-Fi 6E/7, IoT, and defense radar applications with end-to-end RF co-design support from specification through production.
- Filters + PA + switch + antenna integration
- End-to-end RF co-design support
- Antenna-in-Package (AiP) capability
Testing & Characterization
Comprehensive RF testing and characterization capabilities ensure every package meets your frequency, power, and reliability specifications.
S-Parameter Testing
Vector network analysis for insertion loss, return loss, and isolation characterization across the full operating frequency range.
Impedance Verification
Time-domain reflectometry (TDR) for controlled impedance verification of transmission lines, vias, and interconnects within the package.
Thermal Characterization
Junction-to-case and junction-to-board thermal resistance measurement. IR thermography for hot-spot identification under RF power dissipation.
Reliability Qualification
JEDEC and MIL-STD qualification testing including HAST, thermal cycling, mechanical shock, and vibration for mission-critical RF applications.
Wire Bond Pull & Shear
Destructive and non-destructive bond integrity testing per MIL-STD-883. Wire bond pull strength and die shear force validation for every lot.
X-Ray & Acoustic Imaging
Non-destructive inspection of solder joints, die attach, wire bonds, and internal package structures. C-SAM for delamination detection.
RF & MW Assemblies & Packaging
Our Class 1000 cleanroom facility and advanced assembly equipment deliver the precision and repeatability required for high-frequency packaging. Wire bonding, die attach, and encapsulation processes are optimized for RF performance across the full frequency spectrum.
- Fine-pitch wire bonding optimized for RF
- Automated die attach with voiding control
- Selective encapsulation for RF-sensitive areas
- Full traceability from wafer to packaged device
Application Areas
Precision RF packaging for the most demanding frequency, power, and reliability requirements across defense, commercial, and automotive sectors.
Defense & Radar
MIL-STD qualified packages for phased array, EW, and SIGINT systems.
5G & Telecom
FR1/FR2 base station PA modules, small cell front-ends, and MIMO arrays.
Automotive Radar
77 GHz FMCW radar SoC packaging for ADAS and autonomous driving.
Satellite & Space
Ka/Ku-band VSAT terminals, LEO constellation payloads, and space-grade assemblies.
Discuss Your RF Project
Partner with izmomicro for precision RF and microwave packaging that delivers the frequency performance, impedance control, and reliability your application demands. From co-design through volume assembly.
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Design & simulation support
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Prototype through volume production
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JEDEC & AEC-Q100 qualification
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IP-secure packaging environment
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IP-secure Class 1000 cleanroom environment