Flip Chip Assembly
High-density flip chip bonding for superior electrical performance, reduced parasitics, and compact form factors in advanced IC packages.
Sip Manufacturing
SYSTEM-IN-PACKAGE MANUFACTURING
Multi-Die Integration for
Mission-Critical Systems
From substrate design through volume production - advanced SiP manufacturing with 3D die stacking, flip chip assembly, wire bonding, and hermetic sealing at India's only dedicated advanced packaging facility.
- Die-to-Die Accuracy
- ±5µm
- Wire Bond Pitch
- 25µm
- Die Stacking
- 3D
- Cleanroom Facility
- C1000
- Die-to-Die Accuracy
- ±5µm
- Wire Bond Pitch
- 25µm
- Die Stacking
- 3D
- Cleanroom Facility
- C1000
PACKAGING EXPERTISE
From Substrate Design to Volume Production
izmomicro provides comprehensive semiconductor packaging services spanning the full product lifecycle. Our capabilities cover substrate design, die attach, wire bonding, flip chip assembly, encapsulation, testing, and qualification - all under one roof at our ISO 9001:2015-certified facility in Bangalore.
- Flip chip, wire bonding, and die attach processes
- 3D die stacking for maximum functional density
- Automated molding and encapsulation
- QFN, BGA, MCM, and hermetic packaging
FEATURED PRODUCTS
Engineered for the Most Demanding Environments
From space-grade 3D SiP modules achieving 64× footprint reduction to hermetically sealed packages for military applications, our products are proven in the field.
- Space-grade satellite payload electronics
- Defense-grade hermetic packaging
- High-density RF SoC boards for telecom
- Power modules for EV and industrial applications
PRODUCT CATEGORIES
Package Types & Module Assemblies
A comprehensive portfolio of standard and custom package formats, from single-chip carriers to complex multi-chip modules.
Package Formats
- QFN - Quad Flat No-lead
- BGA - Ball Grid Array
- PQFP - Plastic Quad Flat Pack
- CQFP - Ceramic Quad Flat Pack
- DIP - Dual Inline Package
- Leadless Chip Carrier
- COB - Chip on Board
Module Assemblies
- MCM - Multi-Chip Modules
- System-in-Package (SiP)
- Thick Film Hybrid Modules
- Thin Film Hybrid Modules
- RF and Microwave Modules
TECHNOLOGY & PROCESS
Advanced Manufacturing Infrastructure
State-of-the-art equipment and specialized processes for high-reliability semiconductor packaging.
Purpose-built for high-reliability semiconductor and photonics packaging, izmomicro's advanced manufacturing infrastructure combines a Class 1000 cleanroom, precision assembly systems, specialized packaging equipment, and controlled process environments.
PROCESS CAPABILITIES
Advanced Manufacturing Processes
Specialized process technologies enabling high-reliability packaging for the most challenging applications.
3D Packaging
Multi-level die stacking (3D IC) integration for maximum functional density, enabling dramatic footprint reduction in space-constrained systems.
MEMS Packaging
Specialized packaging for micro-electro-mechanical systems requiring zero-stress die attach, environmental protection, and reliable mechanical interfaces.
Thin Die / Brittle Die Handling
Expert handling of ultra-thin and mechanically sensitive dies with specialized tooling and processes to maintain structural integrity.
Hermetic Sealing
MIL-STD hermetic packaging for military, space, and high-reliability applications requiring long-term environmental protection and moisture resistance.
Optical Assembly
Precision optical component integration, including fiber alignment, lens mounting, and optoelectronic assemblies for optical communication and sensing applications.
MANUFACTURING CAPABILITIES
End-to-End Semiconductor Packaging Infrastructure
Our ISO 9001:2015-certified facility houses a Class 1000 cleanroom with automated die attach, thermosonic bonding, flip chip placement, molding and encapsulation, and full electrical and environmental test capabilities.
- Automated die attach and wire bonding
- Transfer and compression molding
- Solder ball attach and reflow
- Engineering samples through volume production
DESIGN CAPABILITIES
Engineering Analysis & Package Design
Advanced simulation and analysis capabilities supporting every aspect of package design and validation.
Package Design
Designs, LTCC, HTCC, and Thermally Enhanced substrate designs for optimized signal integrity and reliability.
SI & PI Analysis
Signal Integrity and Power Integrity analysis ensuring clean signal transmission and stable power delivery at high frequencies.
Thermal & Thermo-mechanical
Heat transfer simulation and thermo-mechanical stress analysis for device operation at extreme temperature environments.
EMI/EMC Analysis
Electromagnetic interference and compatibility analysis ensuring designs meet stringent electromagnetic compatibility standards.
GET STARTED
Start Your SiP Project
Partner with izmomicro for advanced IC packaging and SiP manufacturing. From initial package design and simulation through volume production, our team delivers the expertise and infrastructure to bring your semiconductor products to market.
- Substrate design & simulation support
- Engineering samples through volume production
- ISO 9001:2015 certified facility
- Hermetic & high-reliability packaging