izmo Microsystems Pvt.Ltd.
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Silicon Photonics

Flagship Capability

Silicon Photonics
Packaging

<2 dB Insertion Loss
sub-µm Active Alignment
32-ch Fiber I/O Platform
Class 1000 Cleanroom Facility
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Silicon photonics chip stack with optical layers
The Challenge

Beyond the Limits of Copper

Traditional copper interconnects are reaching fundamental bandwidth and power-density limitations. As data center bandwidth demands surge past 800G and beyond, electrical interconnects face insurmountable walls in signal integrity, power consumption, and thermal dissipation.

Silicon photonics replaces copper with light, enabling orders-of-magnitude improvements in data throughput at a fraction of the energy cost. However, realizing these gains requires solving deeply complex packaging challenges.

  • Sub-micron alignment precision for fiber arrays and waveguides
  • Thermal expansion mismatch between heterogeneous materials
  • Co-packaging electronic and photonic dies without compromising either
APPLICATIONS

Where Photonics Meets Industry

Silicon photonics is transforming five key sectors where optical performance, bandwidth density, and energy efficiency are non-negotiable.

Data Centers
Data Centers
Co-packaged optics for hyperscale architectures. 51.2T switch bandwidth with 50% power reduction per bit.
Primary
Telecom
Telecom
5G/6G coherent transceivers, fronthaul and long-haul optical links with PAM4 modulation.
Core
AI / ML
AI / ML
Photonic accelerators and neuromorphic architectures for inference-scale optical computing.
Emerging
Automotive LiDAR
Automotive LiDAR
Solid-state LiDAR photonic ICs with integrated beam steering and high-resolution depth sensing.
Growth
Medical / Biosensing
Medical / Biosensing
OCT, spectroscopy, and lab-on-chip biosensing with precision waveguide packaging.
Growth
Assembly Process

From Die Attach to Final Test

Our photonic packaging workflow is engineered for precision at every stage, with dedicated equipment and processes for each assembly step.

Precision Die Attach

High-accuracy die placement with eutectic and epoxy bonding for photonic and electronic dies on common substrates. Placement accuracy within ±5µm for initial positioning.

Wire Bonding & Interconnect

Fine-pitch wire bonding and flip-chip assembly for high-density electrical connections between photonic and electronic components. RF-optimized routing.

Active Optical Alignment

Sub-micron precision alignment of fiber arrays and waveguides with real-time optical feedback and UV-cure fixation. <2 dB insertion loss per channel.

Test & Validation

Custom optical characterization: insertion loss, return loss, polarization-dependent loss, and spectral response across all channels at operating wavelengths.

Key Differentiators

What Sets Our Photonic Packaging Apart

End-to-end photonic packaging capabilities built on decades of advanced semiconductor assembly experience.

Heterogeneous SiP Integration

Heterogeneous SiP Integration

Multi-die assembly combining silicon photonic dies, III-V laser sources, and electronic ASICs into a single cohesive package.

Sub-Micron Active Alignment

Sub-Micron Active Alignment

Real-time optical feedback alignment systems for fiber arrays and waveguides, achieving less than 2 dB insertion loss per channel.

Co-Packaged Optics (CPO)

Co-Packaged Optics (CPO)

Photonic engines integrated with switch ASICs on a common substrate for next-generation data center architectures.

Class 1000 Cleanroom

Class 1000 Cleanroom

ISO 9001:2015 certified assembly environment with full traceability for every photonic package produced.

Data center server aisle
Featured Capability

Co-Packaged Optics for Data Centers

Eliminates the transceiver bottleneck by placing photonic engines directly adjacent to switch ASICs, slashing power per bit by up to 50% while enabling 51.2T switch bandwidth and beyond.

Our packaging supports multi-channel fiber I/O with low-insertion-loss attachment optimized for high-radix, spine-leaf topologies.

51.2TSwitch Bandwidth
50%Power Reduction
32-ChFiber I/O
<2 dBInsertion Loss
The Challenge

Exclusive Industry Partner - IIT Madras CPPICS

As the exclusive industry partner of the Centre for Programmable Photonic Integrated Circuits and Systems (CPPICS) at IIT Madras, izmomicro holds a unique position at the intersection of photonics research and industrial-scale packaging. This partnership enables joint development of next-generation photonic technologies, with izmomicro providing the packaging infrastructure to translate laboratory breakthroughs into manufacturable products.

Collaborative Research Areas

  • Programmable Photonic Processors (FPPGA)

    Field-programmable photonic gate arrays enabling reconfigurable optical signal processing for telecom switching, RF filtering, and neural network inference

  • Quantum & AI-Driven Photonic Integration

    Advanced packaging for quantum photonic circuits and AI-accelerated photonic systems, including entangled-photon sources and programmable linear optical networks

  • Silicon Photonics for Telecom & Computing

    High-speed coherent transceiver packaging, co-packaged optics for hyperscale data centers, and photonic interposers for chiplet-based computing architectures

IITM CPPICS
IIT Madras Exclusive Partnership
+
izmomicro

Photonic Chip Packaging Initiative

Advancing Next-Generation Photonic Processors

Get Started

Discuss Your Silicon Photonics Project

Whether you're developing a silicon photonic transceiver, co-packaged optics module, or a novel photonic integrated circuit, our team provides end-to-end packaging support from design consultation through volume manufacturing.

  • Photonic circuit design-for-packaging consultation

  • Prototype assembly with sub-micron alignment

  • Custom optical test & characterization protocols

  • Mid-volume to production-scale manufacturing

  • IP-secure Class 1000 cleanroom environment