Engineering for Endurance: A Case Study in Thermal Management for a Global Leader in 3D Printing
Aug 30, 2025
Introduction: The Challenge of Sustained High Performance
In industrial 3D printing, reliability over extended runs is critical. One global leader in 3D printing solutions faced a major hurdle: their printers relied on a 96-channel data driver packaged in a PQFP (Plastic Quad Flat Pack). While effective for short tasks, the component frequently overheated during continuous operation, leading to failures, wasted material, and costly downtime.
The issue was clear — the PQFP package was not designed for adequate heat dissipation. The client needed a packaging solution that could manage thermal stress during long-duration tasks without changing the semiconductor die itself.
The Problem: Overheating in PQFP Packaging
The client’s PQFP-based component created multiple risks:
- Poor thermal dissipation: Heat built up during extended use.
- High failure risk: Junction temperatures exceeded safe thresholds.
- Customer impact: Failed prints and downtime undermined reliability.
They required a drop-in packaging solution capable of sustaining continuous operation under heavy load.
The Solution: A Thermally Enhanced BGA Package
izmomicro’s Advanced Technology Manufacturing & Packaging (ATMP) team engineered a new Thermally Enhanced Ball Grid Array (TEBGA) package to replace the PQFP.
Why TEBGA?
- Integrated copper heat slug with low thermal resistance
- Direct thermal pathway from die to PCB/heatsink
- Superior dissipation compared to PQFP, enabling safe long-term performance
This innovative shift unlocked the full performance of the 96-channel driver, making reliable continuous operation possible.
Overcoming Key Engineering Challenges
Designed to handle sustained thermal loads
Advanced thermal simulations validated real-world endurance
- Heat Extraction for Long Durations
Designed to handle sustained thermal loads
Advanced thermal simulations validated real-world endurance
- Form Factor Preservation
Developed a compact custom TEBGA within size limits
Optimized heat conduction ensured safe thresholds
- Junction Temperature Management
Strict targets: Tj ≤ 65°C; Tc ≤ 16°C
Optimized heat conduction ensured safe thresholds
Implementation: Precision Thermal Engineering
izmomicro followed a systematic process:
- Die Procurement: Acquired HV582 dies used in the original PQFP.
- Thermal Analysis: Assessed power dissipation and thermal pathways.
- Copper Slug Integration: Inserted a 0.7 mm copper slug to enhance conduction.
- High-Thermal Epoxy: Applied Namics epoxy for efficient transfer from die to slug.
- Simulation & Validation: Modeled and tested full assemblies under stress.
The outcome: a thermally robust TEBGA package that consistently exceeded performance benchmarks. And this entire well-designed manufacturing process was carried out in our state-of-the-art cleanroom facility in Bangalore.
Results & Benefits
- Continuous reliable operation under heavy printing workloads
- Safe thermal limits maintained — Tj and Tc within design thresholds
- Form-fit compatibility — same footprint, no redesign needed
- Reduced downtime & waste — improved customer satisfaction
Conclusion: Reliable Innovation Through Partnership
This project demonstrates izmomicro’s ability to solve complex thermal challenges through advanced packaging. By replacing PQFP with a thermally enhanced BGA, the client achieved failure-free, long-duration performance in their 3D printers.
For the client, the solution delivered both immediate reliability and a scalable blueprint for managing similar challenges across future product lines. For izmomicro, it reinforced their position as a trusted partner in bespoke, high-reliability solutions for
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