Introduction

Autonomous systems demand computing solutions that are compact, rugged, and capable of high performance under extreme conditions. A leading industrial automation organization partnered with izmomicro to convert a traditional CPU box into a VPX 6U slot-mountable Single Board Computer (SBC).

Client Requirement

The customer required a VPX (VITA 46/48 standard) 6U slot-mountable SBC, integrating CPU functionality into a compact board form. Objectives included:

• Fit within 233.4 mm x 160 mm VPX 6U constraints.
• Full integration of multiple CPU card functions.
• Optimized signal integrity (SI), power integrity (PI), and thermal management.
• Reliable operation under demanding power and environmental conditions.

Design Challenges

The project posed several technical hurdles:

  – Dense component placement within the 6U VPX footprint.

System Complexity – Integration of PCIe, SERDES, SDRAM, DDR, NVSRAM, and dual FPGAs.

Power Management – Multiple regulated voltages in limited space without noise issues.

High-Speed Interfaces – Low-loss routing for PCIe switch and Marvell Gigabit transceivers.

Thermal Demands – Ensuring stability and dissipation under harsh conditions.

Solution Approach

izmomicro engineered the SBC VPX solution through a simulation-driven methodology:

PCB Layout – Designed an 18-layer PCB in Cadence Allegro with 2061 nets, 2300 components, and 15 BGAs.

Mixed-Signal Isolation – Careful separation of analog, digital, and high-speed domains to reduce noise.

Material Optimization – Used Nelco N4000-13EP for low-loss high-speed performance.

Power Architecture – Designed multi-rail regulation for DDR, PCIe, and FPGA support.

Thermal Design – Validated dissipation strategies using Ansys Icepack.

Engineering Implementation

Signal & Power Integrity Analysis

• DDR2 and PCIe SI simulations included setup/hold, eye diagrams, and overshoot/undershoot checks.
• PI simulations validated clean, stable delivery across multiple rails.

Crosstalk & Bus Validation

• Conducted WRITE and READ simulations, confirming reliable high-speed transfers.

Component Integration

• Integrated Marvell Gigabit transceivers, dual FPGAs, DDR memory, and PCIe switching fabric without degradation.

Design-to-Fabrication Success

• Optimized schematic and layout achieved single-spin fabrication, saving time and cost.

This meticulous manufacturing process was carried out in our state-of-the-art cleanroom facility in Bangalore.

Results & Outcomes

The project delivered a robust SBC VPX solution:

• CPU Box Conversion – Complete integration into VPX 6U slot form.
• First-Pass Success – Design to fabrication in one iteration.
• Reliable High-Speed Performance – Validated DDR and PCIe operation.
• Optimized Thermal Stability – Simulation results matched real-world conditions.
• Future-Ready Scalability – Modular design supports evolving research needs.

Strategic Impact

For the client:

• Reduced Risk – Simulation-first approach minimized rework.
• Faster Deployment – Single-spin success accelerated timelines.
• Cost Efficiency – Material and design balance controlled expenses.
• Long-Term Reliability – Designed for mission-critical environments.

For izmomicro:

• Reinforced position as a trusted partner in SBC VPX and high-speed board design, with proven expertise in SI/PI analysis, thermal optimization, and dense PCB layouts.

Conclusion

izmomicro successfully transformed a traditional CPU box into a mission-ready 18-layer VPX 6U SBC—delivering compactness, performance, and reliability in one pass. By leveraging simulation, advanced materials, and careful mixed-signal design, the team provided a scalable, future-proof computing platform.

As demand for rugged, high-performance embedded solutions grows in various segments, izmomicro stands out as a partner of choice for first-pass success and long-term reliability.