Introduction
In semiconductor technology, component obsolescence can threaten mission-critical systems, particularly in high-reliability applications. When a specialized ASIC used for LVDT (Linear Variable Differential Transformer) Signal Conditioning and Health Monitoring reached end-of-life, a Bangalore-based electronics manufacturer faced a major roadblock.
Instead of treating this as a setback, izmomicro transformed the challenge into an opportunity—delivering a Chiplet-based System-in-Package (SiP) that not only replicated the obsolete device but also improved tolerance, reliability, and future scalability.
The Challenge: Replacing a Unique ASIC
The client relied on a custom ASIC to process LVDT signals—vital for accurate displacement measurement. When production of the ASIC stopped, there was no simple substitute.
The requirement: A Form-Fit-Function match that would:
The task demanded more than a replacement—it required a ground-up engineering solution.
The Solution: Chiplet-Based Redesign
izmomicro adopted a Chiplet-based architecture instead of designing a new monolithic ASIC.
Key steps included:
Advantages:
This approach solved the immediate obsolescence issue while enhancing long-term performance.
Implementation & Engineering Excellence
Turning the design into a qualified production device required advanced packaging and system expertise.
Engineering highlights:
Thermal Management:
The rigorous qualification process guaranteed readiness for high-reliability applications from day one. This entire thought-through manufacturing process was carried out in our state-of-the-art cleanroom facility in Bangalore.
The Result: A Future-Proof SiP
The final System-in-Package for LVDT Signal Conditioning & Health Monitoring delivered:
Impact
For the client:
For izmomicro:
Conclusion
By re-engineering an obsolete ASIC into a Chiplet-based SiP, izmomicro delivered more than a replacement—it delivered an upgrade. The project illustrates how proactive innovation can turn obsolescence into an opportunity, ensuring resilience, long-term reliability, and performance gains.
As industries face increasing challenges with component availability, izmomicro’s expertise in system design, packaging, and chiplet integration makes it a trusted partner for organizations seeking future-proof, first-time-right solutions.