Introduction

In semiconductor technology, component obsolescence can threaten mission-critical systems, particularly in high-reliability applications. When a specialized ASIC used for LVDT (Linear Variable Differential Transformer) Signal Conditioning and Health Monitoring reached end-of-life, a Bangalore-based electronics manufacturer faced a major roadblock. Instead of treating this as a setback, izmomicro transformed the challenge into an opportunity—delivering a Chiplet-based System-in-Package (SiP) that not only replicated the obsolete device but also improved tolerance, reliability, and future scalability.

The Challenge: Replacing a Unique ASIC

The client relied on a custom ASIC to process LVDT signals—vital for accurate displacement measurement. When production of the ASIC stopped, there was no simple substitute.
The requirement: A Form-Fit-Function match that would:

• Physically fit the existing circuit board
• Connect to the same pins
• Perform identical functions
• Maintain or exceed performance standards

The task demanded more than a replacement—it required a ground-up engineering solution.

The Solution: Chiplet-Based Redesign

izmomicro adopted a Chiplet-based architecture instead of designing a new monolithic ASIC.

Key steps included:

• Analyzing the obsolete ASIC’s functional blocks.
• Breaking functions into smaller dies ("chiplets”).
• Sourcing off-the-shelf dies to replicate each function.
• Integrating them into a custom System-in-Package (SiP) on a single substrate.

Advantages:

• Delivered precise Form-Fit-Function compliance by controlling package size and pin layout.
• Allowed integration of higher-performance dies, improving tolerance and reliability.
• Established a future-ready foundation, enabling second-generation designs with silicon interposers for even greater integration.

This approach solved the immediate obsolescence issue while enhancing long-term performance.

Implementation & Engineering Excellence

Turning the design into a qualified production device required advanced packaging and system expertise.

Engineering highlights:

• Substrate & Package Design – Built on an 8-layer board for seamless mixed-signal handling.
• Device Versions –
  -Device-1: 7 dies + 60 passive components
  Device-2: 6 dies + 49 passive components
• Material Selection – High-performance BT substrate ensured integrity and durability.

Thermal Management:

• Simulations in Icepack validated safe operating temperatures.
• Thermal stress prevention ensured long-term reliability under demanding conditions.

Advanced Manufacturing Expertise

The rigorous qualification process guaranteed readiness for high-reliability applications from day one. The parts were manufactured at our state-of-the-art class 1000 Cleanroom IC Packaging facility in Bangalore.

The Result: A Future-Proof SiP

The final System-in-Package for LVDT Signal Conditioning & Health Monitoring delivered:

• Full Form-Fit-Function compatibility with the obsolete ASIC.
• Improved tolerance and reliability, surpassing the original device.
• Qualification for mission-critical applications, ensuring uninterrupted client operations.
• The parts were manufactured at our state-of-the-art class 1000 Cleanroom IC Packaging facility in Bangalore

Impact

For the client:

• Business continuity despite component obsolescence.
• Enhanced performance through better tolerance and reliability.
• Future scalability with a chiplet-based foundation adaptable to next-gen designs.

For izmomicro:

• Reinforced its leadership in advanced semiconductor packaging.
• Demonstrated capability in chiplet integration, mixed-signal design, and thermal optimization.
• Proven track record in first-pass, production-ready solutions for high-reliability applications.

Conclusion

By re-engineering an obsolete ASIC into a Chiplet-based SiP, izmomicro delivered more than a replacement—it delivered an upgrade. The project illustrates how proactive innovation can turn obsolescence into an opportunity, ensuring resilience, long-term reliability, and performance gains.

As industries face increasing challenges with component availability, izmomicro’s expertise in system design, packaging, and chiplet integration makes it a trusted partner for organizations seeking future-proof, first-time-right solutions.