Overcoming Obsolescence: A New Era for LVDT Signal Conditioning & Health Monitoring
Overcoming Obsolescence: A New Era for LVDT Signal Conditioning & Health Monitoring
Introduction
In semiconductor technology, component obsolescence can threaten mission-critical systems, particularly in high-reliability applications. When a specialized ASIC used for LVDT (Linear Variable Differential Transformer) Signal Conditioning and Health Monitoring reached end-of-life, a Bangalore-based electronics manufacturer faced a major roadblock.
Instead of treating this as a setback, izmomicro transformed the challenge into an opportunity—delivering a Chiplet-based System-in-Package (SiP) that not only replicated the obsolete device but also improved tolerance, reliability, and future scalability.
The Challenge: Replacing a Unique ASIC
The client relied on a custom ASIC to process LVDT signals—vital for accurate displacement measurement. When production of the ASIC stopped, there was no simple substitute.
The requirement: A Form-Fit-Function match that would:
The Solution: Chiplet-Based Redesign
izmomicro adopted a Chiplet-based architecture instead of designing a new monolithic ASIC.
Key steps included:
Advantages:
Implementation & Engineering Excellence
Turning the design into a qualified production device required advanced packaging and system expertise.
Engineering highlights:
Device-2: 6 dies + 49 passive components
Thermal Management:
Advanced Manufacturing Expertise
The rigorous qualification process guaranteed readiness for high-reliability applications from day one. The parts were manufactured at our state-of-the-art class 1000 Cleanroom IC Packaging facility in Bangalore.
The Result: A Future-Proof SiP
The final System-in-Package for LVDT Signal Conditioning & Health Monitoring delivered:
Impact
For the client:
For izmomicro:
Conclusion
By re-engineering an obsolete ASIC into a Chiplet-based SiP, izmomicro delivered more than a replacement—it delivered an upgrade. The project illustrates how proactive innovation can turn obsolescence into an opportunity, ensuring resilience, long-term reliability, and performance gains.
As industries face increasing challenges with component availability, izmomicro’s expertise in system design, packaging, and chiplet integration makes it a trusted partner for organizations seeking future-proof, first-time-right solutions.
Introduction
In semiconductor technology, component obsolescence can threaten mission-critical systems, particularly in high-reliability applications. When a specialized ASIC used for LVDT (Linear Variable Differential Transformer) Signal Conditioning and Health Monitoring reached end-of-life, a Bangalore-based electronics manufacturer faced a major roadblock.
Instead of treating this as a setback, izmomicro transformed the challenge into an opportunity—delivering a Chiplet-based System-in-Package (SiP) that not only replicated the obsolete device but also improved tolerance, reliability, and future scalability.
The Challenge: Replacing a Unique ASIC
The client relied on a custom ASIC to process LVDT signals—vital for accurate displacement measurement. When production of the ASIC stopped, there was no simple substitute.
The requirement: A Form-Fit-Function match that would:
- Physically fit the existing circuit board
- Connect to the same pins
- Perform identical functions
- Maintain or exceed performance standards
The Solution: Chiplet-Based Redesign
izmomicro adopted a Chiplet-based architecture instead of designing a new monolithic ASIC.
Key steps included:
- Analyzing the obsolete ASIC’s functional blocks.
- Breaking functions into smaller dies ("chiplets”).
- Sourcing off-the-shelf dies to replicate each function.
- Integrating them into a custom System-in-Package (SiP) on a single substrate.
Advantages:
- Delivered precise Form-Fit-Function compliance by controlling package size and pin layout.
- Allowed integration of higher-performance dies, improving tolerance and reliability.
- Established a future-ready foundation, enabling second-generation designs with silicon interposers for even greater integration.
Implementation & Engineering Excellence
Turning the design into a qualified production device required advanced packaging and system expertise.
Engineering highlights:
- Substrate & Package Design – Built on an 8-layer board for seamless mixed-signal handling.
- Device Versions –
Device-2: 6 dies + 49 passive components
- Material Selection – High-performance BT substrate ensured integrity and durability.
Thermal Management:
- Simulations in Icepack validated safe operating temperatures.
- Thermal stress prevention ensured long-term reliability under demanding conditions.
Advanced Manufacturing Expertise
The rigorous qualification process guaranteed readiness for high-reliability applications from day one. The parts were manufactured at our state-of-the-art class 1000 Cleanroom IC Packaging facility in Bangalore.
The Result: A Future-Proof SiP
The final System-in-Package for LVDT Signal Conditioning & Health Monitoring delivered:
- Full Form-Fit-Function compatibility with the obsolete ASIC.
- Improved tolerance and reliability, surpassing the original device.
- Qualification for mission-critical applications, ensuring uninterrupted client operations.
- The parts were manufactured at our state-of-the-art class 1000 Cleanroom IC Packaging facility in Bangalore
Impact
For the client:
- Business continuity despite component obsolescence.
- Enhanced performance through better tolerance and reliability.
- Future scalability with a chiplet-based foundation adaptable to next-gen designs.
For izmomicro:
- Reinforced its leadership in advanced semiconductor packaging.
- Demonstrated capability in chiplet integration, mixed-signal design, and thermal optimization.
- Proven track record in first-pass, production-ready solutions for high-reliability applications.
Conclusion
By re-engineering an obsolete ASIC into a Chiplet-based SiP, izmomicro delivered more than a replacement—it delivered an upgrade. The project illustrates how proactive innovation can turn obsolescence into an opportunity, ensuring resilience, long-term reliability, and performance gains.
As industries face increasing challenges with component availability, izmomicro’s expertise in system design, packaging, and chiplet integration makes it a trusted partner for organizations seeking future-proof, first-time-right solutions.