High-Density SBC VPX Board Design for a Government Research Lab
High-Density SBC VPX Board Design for a Government Research Lab
Introduction
Autonomous systems demand computing solutions that are compact, rugged, and capable of high performance under extreme conditions. A leading industrial automation organization partnered with izmomicro to convert a traditional CPU box into a VPX 6U slot-mountable Single Board Computer (SBC).
This project involved advanced PCB layout, signal and power integrity analysis, and thermal management—all within stringent size and environmental constraints. The result was an 18-layer mixed-signal SBC VPX board that met the lab’s mission-critical requirements.
Client Requirement
The customer required a VPX (VITA 46/48 standard) 6U slot-mountable SBC, integrating CPU functionality into a compact board form. Objectives included:
Design Challenges
The project posed several technical hurdles:
Solution Approach
izmomicro engineered the SBC VPX solution through a simulation-driven methodology:
Engineering Implementation
Signal & Power Integrity Analysis
The project delivered a robust SBC VPX solution:
Strategic Impact
For the client:
Conclusion
izmomicro successfully transformed a traditional CPU box into a mission-ready 18-layer VPX 6U SBC—delivering compactness, performance, and reliability in one pass. By leveraging simulation, advanced materials, and careful mixed-signal design, the team provided a scalable, future-proof computing platform.
As demand for rugged, high-performance embedded solutions grows in various segments, izmomicro stands out as a partner of choice for first-pass success and long-term reliability.
Introduction
Autonomous systems demand computing solutions that are compact, rugged, and capable of high performance under extreme conditions. A leading industrial automation organization partnered with izmomicro to convert a traditional CPU box into a VPX 6U slot-mountable Single Board Computer (SBC).
This project involved advanced PCB layout, signal and power integrity analysis, and thermal management—all within stringent size and environmental constraints. The result was an 18-layer mixed-signal SBC VPX board that met the lab’s mission-critical requirements.
Client Requirement
The customer required a VPX (VITA 46/48 standard) 6U slot-mountable SBC, integrating CPU functionality into a compact board form. Objectives included:
- Fit within 233.4 mm x 160 mm VPX 6U constraints.
- Full integration of multiple CPU card functions.
- Optimized signal integrity (SI), power integrity (PI), and thermal management.
- Reliable operation under demanding power and environmental conditions.
Design Challenges
The project posed several technical hurdles:
- Form Factor – Dense component placement within the 6U VPX footprint.
- System Complexity – Integration of PCIe, SERDES, SDRAM, DDR, NVSRAM, and dual FPGAs.
- Power Management – Multiple regulated voltages in limited space without noise issues.
- High-Speed Interfaces – Low-loss routing for PCIe switch and Marvell Gigabit transceivers.
- Thermal Demands – Ensuring stability and dissipation under harsh conditions.
Solution Approach
izmomicro engineered the SBC VPX solution through a simulation-driven methodology:
- PCB Layout – Designed an 18-layer PCB in Cadence Allegro with 2061 nets, 2300 components, and 15 BGAs.
- Mixed-Signal Isolation – Careful separation of analog, digital, and high-speed domains to reduce noise.
- Material Optimization – Used Nelco N4000-13EP for low-loss high-speed performance.
- Power Architecture – Designed multi-rail regulation for DDR, PCIe, and FPGA support.
- Thermal Design – Validated dissipation strategies using Ansys Icepack.
Engineering Implementation
Signal & Power Integrity Analysis
- DDR2 and PCIe SI simulations included setup/hold, eye diagrams, and overshoot/undershoot checks.
- PI simulations validated clean, stable delivery across multiple rails.
- Conducted WRITE and READ simulations, confirming reliable high-speed transfers.
- Integrated Marvell Gigabit transceivers, dual FPGAs, DDR memory, and PCIe switching fabric without degradation.
- Optimized schematic and layout achieved single-spin fabrication, saving time and cost.
- The parts were manufactured at our state-of-the-art class 1000 Cleanroom IC Packaging facility in Bangalore
The project delivered a robust SBC VPX solution:
- CPU Box Conversion – Complete integration into VPX 6U slot form.
- First-Pass Success – Design to fabrication in one iteration.
- Reliable High-Speed Performance – Validated DDR and PCIe operation.
- Optimized Thermal Stability – Simulation results matched real-world conditions.
- Future-Ready Scalability – Modular design supports evolving research needs.
Strategic Impact
For the client:
- Reduced Risk – Simulation-first approach minimized rework.
- Faster Deployment – Single-spin success accelerated timelines.
- Cost Efficiency – Material and design balance controlled expenses.
- Long-Term Reliability – Designed for mission-critical environments.
Conclusion
izmomicro successfully transformed a traditional CPU box into a mission-ready 18-layer VPX 6U SBC—delivering compactness, performance, and reliability in one pass. By leveraging simulation, advanced materials, and careful mixed-signal design, the team provided a scalable, future-proof computing platform.
As demand for rugged, high-performance embedded solutions grows in various segments, izmomicro stands out as a partner of choice for first-pass success and long-term reliability.