Introduction

In aviation electronics, systems are designed to last decades, but component obsolescence poses a serious risk. When critical devices become unavailable, it can jeopardize mission readiness, increase costs, and disrupt supply chains.

This case study highlights how a leading aviation electronics manufacturer partnered with izmomicro to engineer a replacement for an obsolete ASIC device. The project delivered a form-fit-function (FFF) equivalent that not only matched the original component but also ensured long-term availability and reliability.

Problem Statement

The client relied on a specialized ASIC (Application-Specific Integrated Circuit) that eventually went obsolete. Without a replacement, existing systems risked failure and costly redesigns. The client’s needs were clear:

• Form-Fit-Function Replacement - The new component had to work identically to the original.
• Seamless Integration - No redesign of existing PCBs or system architecture.
• Aviation-Grade Reliability - Ability to withstand extreme environmental conditions.
• Future-Proofing - A solution not tied to obsolete suppliers.

Challenges

Developing a drop-in replacement for a discontinued ASIC involved overcoming several engineering barriers:

• Functional Parity - The new device had to exactly replicate the IMS T805 ASIC. Even minor deviations could compromise mission-critical systems.
• Pin-to-Pin Compatibility - Any change in footprint or packaging would require redesign, driving up cost and risk.
• Environmental Robustness - Aviation applications demand resilience against heat, vibration, and EMI.
• Longevity - The solution had to be manufacturable and supported for the long term.

Solution

izmomicro designed a future-ready replacement through a structured engineering process :

1. In-Depth Reverse Engineering

• Studied the original ASIC datasheet to capture its architecture, I/O mapping, and performance parameters.
• Identified critical features that must remain unchanged in the new design.

2. FPGA-Based Recreation

• Recreated ASIC functionality using an OTP (One-Time Programmable) FPGA.
• Enabled flexibility in programming while delivering the same high-performance behavior.

3. Substrate & Packaging Design

• Developed an RDL (Redistribution Layer) substrate for pin-to-pin compatibility, making the device a true drop-in replacement.
• Ensured no PCB redesigns were required.

4. Rigorous Validation

• Tested performance under harsh aviation conditions.
• Verified thermal stability, vibration tolerance, and electrical integrity.

5. Advanced Manufacturing Expertise

• The parts were manufactured at our state-of-the-art class 1000
• Cleanroom IC Packaging facility in Bangalore.

Results

The project provided measurable outcomes for the client:

• Seamless Replacement - The FPGA-based device worked exactly like the original ASIC, maintaining system integrity.
• Reduced Downtime - Delivered as a direct replacement, avoiding delays or redesign cycles.
• Long-Term Reliability - FPGA-based design ensured continued availability, mitigating future obsolescence risks.
• Cost Efficiency - Eliminated the need for new qualification and validation of redesigned systems.
• Aviation-Grade Performance - Proven durability in extreme operational environments.

Conclusion

Obsolescence is one of the most pressing challenges in aviation electronics, where replacing outdated components can be more complex than building new systems. izmomicro’s FPGA-based recreation and custom substrate design provided a drop-in replacement that preserved functionality, reduced costs, and guaranteed long-term supply. This case underscores three key lessons:

• Legacy systems can be sustained without full redesign through form-fit-function replacements.
• FPGA technology is a powerful enabler for replicating obsolete ASICs.
• Close collaboration between client and engineering partner ensures mission-critical reliability.

For the client, the new Link Controller not only solved immediate supply chain risks but also created a scalable blueprint for managing obsolescence across future aviation systems.