Engineering for Endurance: A Case Study in Thermal Management for a Global Leader in 3D Printing
Engineering for Endurance: A Case Study in Thermal Management for a Global Leader in 3D Printing
Introduction: The Challenge of Sustained High Performance
In industrial 3D printing, reliability over extended runs is critical. One global leader in 3D printing solutions faced a major hurdle: their printers relied on a 96-channel data driver packaged in a PQFP (Plastic Quad Flat Pack). While effective for short tasks, the component frequently overheated during continuous operation, leading to failures, wasted material, and costly downtime.
The issue was clear — the PQFP package was not designed for adequate heat dissipation. The client needed a packaging solution that could manage thermal stress during long-duration tasks without changing the semiconductor die itself.
The Problem: Overheating in PQFP Packaging
The client’s PQFP-based component created multiple risks:
The Solution: A Thermally Enhanced BGA Package
izmomicro’s Advanced Technology Manufacturing & Packaging (ATMP) team engineered a new Thermally Enhanced Ball Grid Array (TEBGA) package to replace the PQFP.
Why TEBGA?
Overcoming Key Engineering Challenges
1. Heat Extraction for Long Durations
Implementation: Precision Thermal Engineering
izmomicro followed a systematic process:
Results & Benefits
Conclusion: Reliable Innovation Through Partnership
This project demonstrates izmomicro’s ability to solve complex thermal challenges through advanced packaging. By replacing PQFP with a thermally enhanced BGA, the client achieved failure-free, long-duration performance in their 3D printers.
For the client, the solution delivered both immediate reliability and a scalable blueprint for managing similar challenges across future product lines. For izmomicro, it reinforced their position as a trusted partner in bespoke, high-reliability solutions for demanding applications.
Introduction: The Challenge of Sustained High Performance
In industrial 3D printing, reliability over extended runs is critical. One global leader in 3D printing solutions faced a major hurdle: their printers relied on a 96-channel data driver packaged in a PQFP (Plastic Quad Flat Pack). While effective for short tasks, the component frequently overheated during continuous operation, leading to failures, wasted material, and costly downtime.
The issue was clear — the PQFP package was not designed for adequate heat dissipation. The client needed a packaging solution that could manage thermal stress during long-duration tasks without changing the semiconductor die itself.
The Problem: Overheating in PQFP Packaging
The client’s PQFP-based component created multiple risks:
- Poor thermal dissipation: Heat built up during extended use.
- High failure risk: Junction temperatures exceeded safe thresholds.
- Customer impact: Failed prints and downtime undermined reliability.
The Solution: A Thermally Enhanced BGA Package
izmomicro’s Advanced Technology Manufacturing & Packaging (ATMP) team engineered a new Thermally Enhanced Ball Grid Array (TEBGA) package to replace the PQFP.
Why TEBGA?
- Integrated copper heat slug with low thermal resistance
- Direct thermal pathway from die to PCB/heatsink
- Superior dissipation compared to PQFP, enabling safe long-term performance
Overcoming Key Engineering Challenges
1. Heat Extraction for Long Durations
- Designed to handle sustained thermal loads
- Advanced thermal simulations validated real-world endurance
- Maintained PQFP footprint, avoiding redesigns
- Developed a compact custom TEBGA within size limits
- Strict targets: Tj ≤ 65°C; Tc ≤ 16°C
- Optimized heat conduction ensured safe thresholds
Implementation: Precision Thermal Engineering
izmomicro followed a systematic process:
- Die Procurement: Acquired HV582 dies used in the original PQFP.
- Thermal Analysis: Assessed power dissipation and thermal pathways.
- Copper Slug Integration: Inserted a 0.7 mm copper slug to enhance conduction.
- High-Thermal Epoxy: Applied Namics epoxy for efficient transfer from die to slug.
- Simulation & Validation: Modelled and tested full assemblies under stress.
- Advanced Manufacturing Expertise: The parts were manufactured at our state-of-the-art class 1000 Cleanroom IC Packaging facility in Bangalore.
- The Outcome: a thermally robust TEBGA package that consistently exceeded performance benchmarks.
Results & Benefits
- Continuous reliable operation under heavy printing workloads
- Safe thermal limits maintained — Tj and Tc within design thresholds
- Form-fit compatibility — same footprint, no redesign needed
- Reduced downtime & waste — improved customer satisfaction
Conclusion: Reliable Innovation Through Partnership
This project demonstrates izmomicro’s ability to solve complex thermal challenges through advanced packaging. By replacing PQFP with a thermally enhanced BGA, the client achieved failure-free, long-duration performance in their 3D printers.
For the client, the solution delivered both immediate reliability and a scalable blueprint for managing similar challenges across future product lines. For izmomicro, it reinforced their position as a trusted partner in bespoke, high-reliability solutions for demanding applications.