Introduction: The Challenge of Sustained High Performance

In industrial 3D printing, reliability over extended runs is critical. One global leader in 3D printing solutions faced a major hurdle: their printers relied on a 96-channel data driver packaged in a PQFP (Plastic Quad Flat Pack). While effective for short tasks, the component frequently overheated during continuous operation, leading to failures, wasted material, and costly downtime.

The issue was clear — the PQFP package was not designed for adequate heat dissipation. The client needed a packaging solution that could manage thermal stress during long-duration tasks without changing the semiconductor die itself.

The Problem: Overheating in PQFP Packaging

The client’s PQFP-based component created multiple risks:

• Poor thermal dissipation: Heat built up during extended use.
• High failure risk: Junction temperatures exceeded safe thresholds.
• Customer impact: Failed prints and downtime undermined reliability.

They required a drop-in packaging solution capable of sustaining continuous operation under heavy load.

The Solution: A Thermally Enhanced BGA Package

izmomicro’s Advanced Technology Manufacturing & Packaging (ATMP) team engineered a new Thermally Enhanced Ball Grid Array (TEBGA) package to replace the PQFP.

Why TEBGA?

• Integrated copper heat slug with low thermal resistance
• Direct thermal pathway from die to PCB/heatsink
• Superior dissipation compared to PQFP, enabling safe long-term performance

This innovative shift unlocked the full performance of the 96-channel driver, making reliable continuous operation possible.

Overcoming Key Engineering Challenges

• Designed to handle sustained thermal loads
• Advanced thermal simulations validated real-world endurance

• Maintained PQFP footprint, avoiding redesigns
• Developed a compact custom TEBGA within size limits

• Strict targets: Tj ≤ 65°C; Tc ≤ 16°C
• Optimized heat conduction ensured safe thresholds

Implementation: Precision Thermal Engineering

izmomicro followed a systematic process:

• Die Procurement: Acquired HV582 dies used in the original PQFP.
• Thermal Analysis: Assessed power dissipation and thermal pathways.
• Copper Slug Integration: Inserted a 0.7 mm copper slug to enhance conduction.
• High-Thermal Epoxy:: Applied Namics epoxy for efficient transfer from die to slug.
• Simulation & Validation: Modelled and tested full assemblies under stress.
• Advanced Manufacturing Expertise: The parts were manufactured at our state-of-the-art class 1000 Cleanroom IC Packaging facility in Bangalore.
• The Outcome: a thermally robust TEBGA package that consistently exceeded performance benchmarks.

Results & Benefits

• Continuous reliable operation under heavy printing workloads
• Safe thermal limits maintained — Tj and Tc within design thresholds
• Form-fit compatibility — same footprint, no redesign needed
• Reduced downtime & waste — improved customer satisfaction

Conclusion: Reliable Innovation Through Partnership

This project demonstrates izmomicro’s ability to solve complex thermal challenges through advanced packaging. By replacing PQFP with a thermally enhanced BGA, the client achieved failure-free, long-duration performance in their 3D printers.

For the client, the solution delivered both immediate reliability and a scalable blueprint for managing similar challenges across future product lines. For izmomicro, it reinforced their position as a trusted partner in bespoke, high-reliability solutions for demanding applications.